Hard Copy Detail
Item Ref:HC0224 |
Location:Hursley Archive - HLG10 - Cupboard / Rack: HC12 - Shelf: 3 |
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Document Title or |
Description |
Author |
Date Published |
Donor |
| Binder Containing: | Manufacturing Engineering Documentation | Various | ||
Where several items are filed together in one binder or folder, the individual titles are shown below |
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| Inspection & Quality Control | of Cross Wire Weled Jooints - article | WM Lovell | 1966 | |
| New Developments | in Thermocompression Bonding - article | D Baker, R Jones | 1966 | |
| Welding Integrated Circuits | into Electronic Equipments | A Godfrey | 1966 | |
| Memo 6152 | Pressure Contact Evaluation - Results | RJ Basher, BK Dunford | 1967 | |
| TR.04.17071.76 | Electroplating of the 65/35 Tin-Nickel Alloy for Printed Circuits | C le Mehaute, B Marzluf IBM France | 1965 | |
| TR 12.058 | The Contact Plating Process x2 | JP Lenoble IBM Hursley | 1964 | |
| TR 12.052 | Interim Report on Investigations into Manufacturing Techniques for Additive Printed Circuits | BP Piggin, J le Noble IBM Hursley | 1963 | |
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